multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 1 /9 ta - i technology co., ltd 1. features 1.1 no polarity due to symmetrical current - voltage characteristics 1.2 excellent electro static absorption capability 1.3 variable capacitance 1.4 working voltage from 2.5 to 300 v rms; 3.3 to 385 vdc 1.5 suitable for esd protection 2. applications 2.1 u sb 3 .0 power and data lines i/o port protection 2.2 notebook and pc computers 2.3 monitors and flat panel displays 2.4 i eee 1394 firewire ports 2.5 video graphics cards 2.6 sim ports mobile phone 2.7 digital camera 2.9 mp3/mp4 player 2.10 lcd module 2.11 h ub/ telecom/ wireless lan 2.12 keyboard 3. type designation 050 120 12v 240 24v mv 06 e 050 t 050 - multilayer varistor size type ser ies max working voltage packaging capacitance internal code 04 0402 06 0603 050 5v 120 12v 240 24v t paper tape 0402 10k 0603 4k 050 5(pf) 100 10(pf) 2r5 2.5(pf)
multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 2 /9 ta - i technology co., ltd 4. dimension type l w d e mm m m mm mm 0 402 1.0 0.10 0.5 0.10 0.6 max 0.25 0.1 0 603 1.6 0.15 0.8 0.15 0.9 max 0.3 0.1
multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 3 /9 ta - i technology co., ltd 5. rating and characteristics part no. size maximum working voltage maximum clamping voltage leakage current capacitance cap. tolerance (unit) (vdc ) (v) (ua) (pf) (%) mv04e050t101 - 0402 5 30 < 1 100 30% mv04e050t560 - 5 50 < 1 56 30% mv04e050t330 - 5 50 < 1 33 30% mv04e050t220 - 5 50 < 1 22 30% mv04e050t100 - 5 50 < 1 10 30% mv04e050t050 - 5 50 < 1 5 +80%/ - 20% mv04e120t101 - 12 50 < 1 100 30% mv04e120t330 - 12 40 < 1 33 30% mv04e120t220 - 12 40 < 1 22 30% mv04e120 t100 - 12 60 < 1 10 30% mv04e120t050 - 12 80 < 1 5 +80%/ - 20% mv04e 24 0t 3 r 0 - 24 100 < 1 3 +80%/ - 20% mv04e 24 0t2r5 - 24 198 < 1 2.5 +80%/ - 20% mv04e 24 0t 0 r 8 - 24 200 < 1 0.8 +80%/ - 20% mv06e050t101 - 0603 5 30 < 1 100 30% mv06e050t560 - 5 50 < 1 56 30% mv06e050t330 - 5 50 < 1 33 30% mv06e050t220 - 5 50 < 1 22 30% mv06e050t100 - 5 50 < 1 10 30% mv06e050t050 - 5 50 < 1 5 +80%/ - 20% mv06e120t101 - 12 50 < 1 100 30% mv06e120t330 - 12 40 < 1 33 30% mv06e120t220 - 12 40 < 1 22 30% mv06e120t100 - 12 60 < 1 10 30% mv06e120t050 - 12 80 < 1 5 +80%/ - 20% mv0 6 e 24 0t 3 r 0 - 24 240 < 1 3 +80%/ - 20% mv0 6 e 24 0t2r5 - 24 198 < 1 2.5 +80%/ - 20% mv0 6 e 24 0t 0 r 8 - 24 200 < 1 0.8 +80%/ - 20%
multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 4 /9 ta - i technology co., ltd 6. reliability test environmental specification test method and description high temperature storage/ dry heat the specimen shall be subjected to 150 2 for 1000 12 hours in a thermostatic bath without load and then stored at room temperature and humidity for 1 to 2 hours. therefore, the change of varistor voltage shall be m easured. temperature cycle the temperature cycle of specified temperature shall be repeated five times and then stored at room temperature and humidity for one or two hours. the change of varistor voltage and mechanical damage shall be examined. step te mperature period 1 - 403 30min3 2 room temperature 1 hour 3 1253 30min3 4 room temperature 1 hours high temperature load after being continuously applied the maximum allowable voltage at 85 2 for 1000 2 hours, the specimen shall be stored at room temperature and humidity for one or two hours, therefore the change of varistor voltage should be measured. dry heat load damp heat load/ the specimen should be subjected to 40 2 , 90 to 95 rh and the maximum allowable voltage for 500 hours and then stored at room temperature and humidity for one or two hours. therefore the change of varistor voltage should be measured. humidity load low temperature storage/ cold the specimen should be subje cted to - 50 2 , without load for 500 hours and then stored at room temperature for one or two hours. therefore the change of varistor voltage should be measured. direct contact electrostatic discharge 1.discharge: contact electrostatic discharge; 2.voltage 8kv level4 3.polarity +, - ; 4.number: 10 times ; 5.interval time 1sec direct air electrostatic discharge 1.discharge: air electrostatic discharge; 2.voltage 15kv level4 3.polarity +, - ; 4.number: 10 times; 5.interval time 1~ 3sec
multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 5 /9 ta - i technology co., ltd 7. taping and reel 7.1 packaging symbol a 0 0.10 b 0 0.10 k 0 0.10 d 0 0.10 p 1 0.10 p 2 0.05 p 0 0.05 w 0.20 e 0.10 f 0.05 0402 0.85 1.25 0.65 1.50 3.00 2.00 4.00 8.00 1.75 3.50 0603 1.08 1.88 0.95 1.50 4.00 2.00 4.00 8.00 1.75 3.50 7.2 reel dime nsions symbol a b c d e w w 1 0402 178.0 1. 0 60 .0 0.5 13 .0 0.2 21.1 0.2 2.0 0.5 9.0 0.50 1.5 0.15 0603 178.0 1. 0 60 .0 0.5 13 .0 0.2 21.1 0.2 2.0 0.5 9.0 0.50 1.5 0.15 p 1
multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 6 /9 ta - i technology co., ltd 8. recommended land patterns 8.1 solder pad la yout 8 . 2 the sir test of the solder paste shall be done 8.3 steel plate and foot distance printing 8.4 reflow and temperature (unit : mm) a b c d 0402 0.4~0.6 1.4~1.8 0.5~0.6 0.6~1.2 0603 0.8~1.2 2.2~2.8 0.6~1.0 0.9~1.5
multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 7 /9 ta - i technology co., ltd 8.5 ir reflow pb free process suggestion profile (1) the solder recommend is sn96.5/ag 3.5 of 120 to 150m (2) ramp - up rate (217 to peak) + 3 /second max (3) temp. maintain at 175 +/ - 25 180 seconds max (4) temp. maintain above 217 60 - 150 seconds (5) peak temperature range 245 +20 / - 10 time within 5 o f actually peak temperature (tp) 10~20 seconds (6) ramp down rate +6 /second max. perform adequate test in advance, as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace. 8.6 resistance to soldering heat - high temp erature resistance: 260 in hand soldering of the varistors. large temperature gradient between preheated the varistors and the tip of soldering iron may cause electrical failures and mechanical damages such as cracking or breakings of the devices. the soldering shall be carefully controlled and carried out so that the temperature gradient is kept minimum with following recommended conditions for hand soldering. 8 . 7 .1 recommended soldering condition 1 (1) solder : 0.12~0.18m m thread solder (sn96.5:ag3.5) with soldering flux in the core. rosin - based and non - activated flux is recommended. (2) preheating : the varistors shall be preheated so that temperature gradient between the devices and the tip of soldering iron is 150 or below. (3) soldering iron : rated power of 20w max with 3mm soldering tip in diameter. temperature of soldering iron tip 380 max,3 - 5sec ( the required amount of solder shall be melted in advance on the soldering tip.) (4) cooling : after soldering. the varistors shall be cooled gradually at room ambient temperature.
multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 8 /9 ta - i technology co., ltd 8 . 7 .2 recommended soldering condition 2 without preheating (1) solder iron tip shall not directly touch to ceramic dielectrics. (2) solder iron tip sh all be fully preheated before soldering while soldering iron tip to the external electrode of varistors. 8.8 post soldering cleaning 8 . 8 .1 residues of corrosive soldering fluxes on the pc board after cleaning may greatly have influences on the electrical characteristic and the reliability (such as humidity resistance) of the varistors which have been mounted on the board. it shall be confirmed that the characteristic and the reliability of the devices are not affected by the applied cleaning conditions 8.8 .2 when an ultrasonic cleaning is applied to the mounted varistors on pc boards. following conditions are recommended for preventing failures or damages of the devices due to the large vibration energy and the resonance caused by the ultrasonic waves. (1) freq uency 29mhz max (2) radiated power 20w/lithr max (3) period 5minuets max 9. storage condition of products 9.1 storage conditions: (1) storage temperature: - 10 ~+40 (2) relative humidity: Q 75%rh (3) varistor must be kept away from sunlight and stored in a non - corrosive at mosphere. 9.2 period of storage: 1 year 10. ecn engineering change notice: the customer will be informed with ecn if there is significant modification on the characteristics and materials described in approval sheet.
multilayer chip varistor for surge and esd protection C e type series document no tmve - xx os 001 c issued date 2012/02/13 page 9 /9 ta - i technology co., ltd 1 1 . manufacturing country & city: (1) ta - i technology ( su zhou ) co., ltd. ( china C su zhou) tel :(+86) 512 - 63457879 fax : (+86) 512 - 63457869 (2) ta - i technology electronic (dongguan ) co., ltd. ( china C dongguan ) tel : (+86) 769 - 8339 - 4790 ? 3 fax : (+86) 769 - 8339 - 4794 (3) fortune task resi stor factory ( china C dongguan ) tel : (+86) 769 - 8339 - 4790 ? 3 fax : (+86) 769 - 8339 - 4794 (4) tai ohm electronics ( m ) sdn. bhd. ( malaysia C penang ) tel :(+60) 4 - 3900480 fax : (+60) 4 - 3901481 (5) p.t.tai electronic indonesia ( indonesia C jakarta ) tel : (+62) 21 - 44820254 fax : (+62) 21 - 44820256
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